Laser Degluing Equipment
Product classification:Semi-conductor
Function Overview:
====【Application】
This equipment is used for adhesive residue by laser for semiconductor product pin after packaging.
product details
==== 【Functions and Features】
1.Laser technology combined with visual positioning, which can achieve 0~0.1MM the minimum distance from the edge of the pin without residual adhesive;
3.The adhesive removal path (width & shape) can be set, saved, called and updated according to product requirements;
4.TT≤1.44S；
5.The adhesive residue removal depth is managed by adjusting the laser band and energy; Different product models can be switched only by calling parameters.