High-precision Chip Transporting Equipment
Product classification:Semi-conductor
Function Overview:
====【Application】
This device is used for handling&transferring chips from a waffle pack to a visual inspection fixture or a wire binding fixture in the production of chips in the semiconductor field.
product details
==== 【Functions and Features】
1. X/Y axes equipped with high-precision linear motor and visual positioning;
2.Gantry structure is made of marble and stainless steel, which is designed for the stable running of the mechanism;
3.Accuracy: ±15UM, Yield: ≥99.8%, TT≤2S；
4.Customized V-shaped automatic guide visual inspection fixture simplifies and quickens the pack cover removal.